Technology Blog

ST. FLORIAN, Austria, July 12 /PRNewswire/ -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has introduced the EVG560HBL wafer bonder -- the industry's first fully automated wafer bonding system for high-brightness light emitting diode (HB-LED) manufacturing. The system features a new design for multi-substrate bonding and is capable of throughput rates of an unprecedented 160 bonds per hour. Based on the successful EVG500 wafer bonding series, the EVG560HBL is optimized to meet the unique requirements of HB-LED manufacturers with the advanced automation capabilities that they will need to increase their production capacity and yields. The HB-LED market continues to grow at a rapid pace due to the rising number of applications that can take advantage of the lower energy consumption and myriad other benefits of LED devices. According to market research firm Strategies Unlimited (Mountain View, Calif.